VeriSilico, in collaboration with Innobase, a wireless communications technology and chip provider, has jointly launched a 5G RedCap/4G LTE dual-mode modem solution.
The chip powering this new modem solution from Innobase has been taped out and verified, is currently in volume production, and will be officially released soon.
5G Reduced Capability (RedCap) is a cellular technology for IoT services defined by the international standards organization 3GPP in 5G Release 17. It is aimed at medium and high speed IoT applications and together with 4G LTE forms a complete cellular IoT ecosystem.
The co-launch of this modem solution comes as part of a strategic partnership between VeriSilicon and Innobase, allowing VeriSilicon to further expand its wireless communications IP portfolio and offer both 4G and 5G modem IP solutions to customers. It will be.
The companies will also offer customers a complete set of user equipment (UE) reference designs covering critical components such as radio frequency (RF) transceivers and power management chipsets.
Lu Wenbo, Senior Vice President of Innobase, said: “By working with VeriSilicon to take full advantage of Innobase’s Yunbao modem and VeriSilicon’s wireless connectivity technology, we will be able to provide our customers with cutting-edge IoT communications connectivity solutions. 5G RedCap/4G LTE Dual We have developed the world’s first commercial IP that meets mode communication standards and have completed chip verification for mass production.
“RedCap communication modules support data and voice services for a variety of application scenarios, including affordable 5G smartphones, wearables, connected smart vehicles, industrial IoT, video surveillance, and smart grids.”
“4G and 5G technologies are mainstream mobile communication standards with long lifecycles and wide range of application scenarios. Innobase has successfully pioneered the successful launch and mass production of 5G RedCap/4G LTE dual-mode modem chips. , which proves our strong R&D and product commercialization capabilities.”
“By leveraging the advantages of the advanced 22nm FD-SOI process of low power consumption and high RF performance, these solutions will integrated into the customer SoC.”
