boston, February 27, 2024 /PRNewswire/ — Once limited to military, satellite, and automotive radar applications, millimeter wave (mmWave) is now entering the mobile communications frequency spectrum, delivering speeds of up to 20 Gbps with ultra-low latency of just 1 ms. Provides high data throughput. . This change requires innovative technology advances across devices, including RF and optical components, low-loss materials, and advanced semiconductor packaging techniques. Among these innovations, packaging stands out as a key area that requires significant development. This is the main focus of IDTechEx’s new report “Antenna in Package (AiP) for 5G and 6G 2024-2034: Technologies, Trends and Markets”.
Overview of antenna packaging technology and operating frequencies. SOURCE IDTechEx
Antenna-in-package (AiP) represents an advanced antenna packaging technology utilized for high frequency communications. AiP takes advantage of the short wavelengths of mmWave applications to enable the creation of significantly smaller antennas that can be seamlessly integrated directly into semiconductor packages, unlike traditional discrete antennas assembled as separate components on a PCB. . Integrating the antenna and transceiver on a single chip offers many benefits, including improved antenna performance and significantly reduced package footprint. Research is underway on new antenna packaging technologies aimed at moving into the sub-THz range, potentially within the 6G spectrum, and integrating antennas directly into RF components. However, this area is still in the research phase due to various manufacturing and scalability challenges.
Overview of antenna packaging technology and operating frequencies. Source: IDTechEx – “Antenna in Package (AiP) for 5G and 6G 2024-2034: Technologies, Trends and Markets”
Key design considerations for AiP
Cost-effectiveness is the most important factor in the development of AiP technology for high-frequency communication equipment. The target stock price is 2 dollars For each 1×1 AiP module, affordability will be critical to widespread adoption, but this is a chicken-and-egg issue and must precede cost savings from economies of scale. there is. Utilizing cost-effective packaging materials and processes is essential. Additionally, miniaturization plays a key role, especially for integration into consumer devices such as smartphones, where component size is of paramount importance. New packaging technologies must be leveraged to reliably reduce package size while maintaining performance and cost efficiency.
Furthermore, achieving high performance is essential for AiP platforms. This requires manufacturing and integrating high-gain, broadband mmWave antenna arrays, as well as ensuring electromagnetic compatibility (EMC) within the system. Additionally, optimizing the equivalent isotropic radiated power (EIRP) and ensuring signal integrity (SI) and power integrity (PI) are also important aspects. Co-designing active mmWave front-end transceiver components with high-quality factor (Q-factor) passive integration further improves performance. Furthermore, reliability is also essential, so a direct thermal path from the chip to the outside world is required to dissipate the heat from the power amplifier. Scalability adds another layer of versatility, allowing for the design of a base module that can be expanded to suit different applications with different power requirements. It is essential to address all these requirements when designing his AiP module for high frequency communication devices. Questions about antenna elements, substrate technology, substrate material selection, limitations of each substrate technology, passive device integration, supply chain maturity, etc. are all answered in IDTechEx’s 5G and 6G 2024-2034 Antenna in Package (AiP) ” is being considered. Technology, Trends and Markets” report.
This new IDTechEx report takes a deep dive into AiP technology tailored for 5G mmWave and emerging 6G networks. Substrate technologies such as organic, LTCC, and glass, as well as packaging methods such as flip-chip and fan-out, are analyzed from material properties to manufacturing feasibility. This report explores antenna integration beyond 100 GHz, provides case studies to address common challenges, and predicts a future driven by advanced semiconductor packaging solutions.
The main aspects of the report are:
5G mmWave development overview and 6G roadmap:
- Explore 5G mmWave developments, innovation roadmap, key applications, and market outlook.
- Understand the 6G landscape, including spectrum potential, enabling THz communications technologies, key research and industry activities, roadmaps, technology goals, and applications.
Learn more about the beamforming technology enabled by 5G mmWave phased array antennas:
- Compare 5G sub-6 and mmWave beamforming technologies.
- Explore phased array technology, including antennas, semiconductors, packaging integration components, technology requirements, trends, and design considerations.
Antenna integration technology for 5G mmWave:
- Discuss antenna substrate technology, benchmarks, material requirements, and phased array packaging.
- Explore different antenna packaging technologies for 5G mmWave, including antennas on PCB and antennas in packages (AiP), categorized by packaging technology (flip-chip vs. fanout). We also discuss the selection of substrate materials such as LTCC, low-loss organic-based, and glass, as well as manufacturing challenges, material selection and benchmarks, solutions/case studies from leading companies, and substrate design considerations for each packaging technology. I will take up.
Antenna integration technology for applications above 100 GHz:
- Addresses the challenges of 6G transceiver development, focusing on power requirements, antenna gain, and phased array demands.
- We discuss the potential of various packaging technologies for applications above 100 GHz, including antenna substrate thermal management options and low-loss material selection. Includes a case study that introduces D-band (110-170 GHz) phased array technology.
Detailed 10-year market forecast:
- 5G infrastructure:
- 5G mmWave base station forecast 2023-2034
- Antenna element prediction (infrastructure)
- AiP Shipment Forecast for 5G mmWave Infrastructure 2023-2034
- mmWave 5G Infrastructure Shipment Forecast by Packaging Technology 2024-2034 AiP
- Millimeter wave antenna board forecast for 5G infrastructure (m2) 2023-2034
- Forecast by material type for mmWave antenna substrates for 5G infrastructure from 2023 to 2034
- 5G consumer devices: smartphones and CPE
- AiP module shipment forecast for millimeter-wave compatible smartphones 2023-2034
- AiP module shipments in mmWave-enabled smartphones by packaging technology 2023-2034
- Millimeter wave smartphone antenna area board using packaging technology 2023-2034
- 5G mmWave CPE Shipment Forecast 2023-2034
- 5G CPE mmWave AiP module shipment forecast by packaging technology 2023-2034
- 5G CPE mmWave AiP Substrate Area Forecast by Packaging Technology 2023-2034
For more information about this latest IDTechEx report, including downloadable sample pages, please visit www.IDTechEx.com/AiP.
Upcoming free webinars to attend
Exploring antenna packaging technology: from 5G mmWave to 6G
doctor Yuhan ChanIDTechEx Senior Technology Analyst and author of this article will be hosting a free-to-attend webinar on this topic. Thursday March 14, 2024 – Exploring antenna packaging technology: from 5G mmWave to 6G.
This webinar includes:
- Overview of antenna mounting technology for high frequency communication
- mmWave antenna packaging strategy:
- Current status of 5G mmWave
- Antenna packaging technology roadmap
- Case Study
- market outlook
- Antenna packaging strategy for 6G (above 100 GHz)
- 6G development roadmap
- Antenna packaging technology roadmap
- Case Study
- Challenges and solutions
Click here to check the times and register your specific time zone. Even if you can’t make it to the date, register to receive on-demand recordings (available for a limited time) and links to webinar slides as soon as they become available.
About IDTechEx
IDTechEx helps customers guide their strategic business decisions and profit from emerging technologies through research, subscription and consulting products.For more information please contact us [email protected] Or visit www.IDTechEx.com.
Download image:
https://www.dropbox.com/scl/fo/ml3zf4aw787defdv71cf9/h?rlkey=ifev3h060kq341sfocory0tai&dl=0
Media contact:
Lucy Rogers
Sales and Marketing Manager
[email protected]
+44(0)1223 812300
Social media links:
twitter: www.twitter.com/IDTechEx
LinkedIn: www.linkedin.com/company/IDTechEx
Photo – https://mma.prnewswire.com/media/2347904/Overview.jpg
Logo – https://mma.prnewswire.com/media/2338688/IDTechEx_logo.jpg
Source IDTechEx
