Ultra-thin MST-compatible RF-SOI substrates are essential for high-performance RF switches, low-noise amplifiers, and more
LOS GATOS, CA / ACCESSWIRE / July 2, 2024 / Atomera Corporation (NASDAQ:ATOM)Atomera, a semiconductor materials and technology licensing company, today announced the availability of its MST® solution, which significantly improves the performance of RFSOI wafer substrates for cutting-edge cellular communications products. The company will demonstrate the solution on experimental 300mm RF-SOI wafers with ultra-thin active layers that leverage a new formulation of Atomera’s MST® technology. For many years, it has been known that thinner RF-SOI substrates would improve performance, but the trade-off between speed and power handling made implementation impractical, until Atomera introduced the solution. When combined with MST, these wafers enable high-performance antenna switches, high-fidelity low-noise amplifiers (LNAs), and other enhanced RF components for 5G Advanced and 6G applications. The company is working with multiple RF IC product manufacturers to evaluate and demonstrate the broad benefits of this MST-enabled technology solution.
“Soitec’s proprietary RF-SOI wafers help design and manufacture high-quality cellular RF products,” said Pierre Cemeli of GM Connect SOI BU at Soitec. “We are pleased to combine our advanced laboratory products with Atomera’s technology as they strive to advance cutting-edge technologies.”
RF-SOI substrates have become the standard platform for many RF devices, especially front-end modules (FEMs), and are used in 100% of today’s 5G smartphones. RF-SOI substrates offer significantly improved linearity and lower noise compared to traditional silicon substrates, and are fully compatible with existing CMOS process flows. RF-SOI products and manufacturing processes are widely available from numerous IC suppliers and foundries.
“We have been working for several years to optimize the performance of RF-SOI applications using MST,” said Atomera CEO Scott Bibeau. “Our current results demonstrate improvements in key RF switch characteristics, such as R.On∙Coff figure of merit, power handling capability, and leakage. We look forward to leveraging Soitec’s experimental ultra-thin RFSOI substrates to advance cellular RF capabilities and enable the next generation of mobile communications.”
Atomera contributes to the development of these advanced substrates and works with the entire RF ecosystem, including IDMs, foundries and fabless RF IC companies. Atomera epitaxially deposits RF-optimized MST film recipes onto Soitec’s ultra-thin 300mm RF-SOI substrates and ships them to development partners for manufacturing. By providing MSTcad® software, Atomera works with select RF-SOI chip designers and foundries to enable them to optimize switches and other circuit devices to get the most out of these substrates.
Advanced RF-SOI substrates can be evaluated today by contacting Atomera.
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About Atomera
Atomera Incorporated, named one of Forbes magazine’s Top 100 Best Small Companies in America for 2022, is a semiconductor materials and technology licensing company focused on deploying proprietary, silicon-proven technologies to the semiconductor industry. Atomera developed Mears Silicon Technology™ (MST®) to improve the performance and power efficiency of semiconductor transistors. MST can be implemented using equipment already installed in semiconductor manufacturing facilities and complements other nanoscaling technologies on the semiconductor industry roadmap. For more information, please visit https://atomera.com/.
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